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BAIP UAB redeemed bonds from INVL Technology

2017-05-05
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INVL Technology announced that BAIP UAB has redeemed bonds issued on 16 January 2017 in the amount of EUR 1.55 million as of 4 May 2017.        

The person authorized to provide additional information:
         Kazimieras Tonkūnas
         INVL Technology Managing Partner
         e-mail [email protected]

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